2026 Taiwan-Europe Chip Innovation Forum (TECIF)
2026 Taiwan-Europe Chip Innovation Forum (TECIF)
Bridging innovation, shaping the next chapter of chip collaboration
Day 1 Exploring Strategic Partnerships and Taiwan-Europe Collaborations
Key leaders and industry pioneers across the Taiwan-Europe value chain gather to share insights. TSRI and imec will show their services and collaborative models, while NIAR and its affiliated centers showcase cutting-edge research to drive cross-domain innovation and future ecosystem growth.
Day 2 Accelerating Research Partnership and Semiconductor Innovation
Day 2 features TSRI’s Special Interest Groups (SIG) and Joint Research Center (JRC) initiatives, bridging Taiwan and international semiconductor communities. Experts across academia and industry will showcase joint achievements in silicon photonics, advanced packaging, smart sensing, compound semiconductors, emerging materials, and 3D integration to foster long-term research partnerships and talent mobility.
Speech Time: Day 1_ Sep. 9th, 15:30 - 15:50
Speech Topic: Germanium-Silicon Photonics Technologies: Past, Present, and Future
Speaker: Neil Na, Co-Founder & CTO, Artilux Inc.
More details, please visit the official event site.