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Your search for "Depth" returned 4 results.
II-VI Incorporated and Artilux Demonstrate a 3D Camera for Enhanced User Experience in the Metaverse
II‐VI Incorporated (Nasdaq: IIVI), a leader in semiconductor lasers, and Artilux, a leader in germanium silicon (GeSi) photonics and CMOS SWIR sensing technology, today announced a joint demonstration of a next-generation 3D camera with much longer range and higher image resolution to greatly enhances user experience in the metaverse.
Artilux Presenting CMOS SWIR Technology for Brighter Tomorrow at COMPUTEX 2022
Artilux, the renowned leader in CMOS SWIR optical sensing technology and GeSi (Germanium Silicon) technology, showcased in COMPUTEX 2022 a full range of products at Booth #N0605a of Taipei Nangang Exhibition Center, Hall 1 from May 24th to 27th. With diverse scenario demonstrations, Artilux gave visitors a glimpse into the vast opportunities in using CMOS SWIR technology to seamlessly integrate optical communication, sensing, and imaging into product solutions to transform users’ day-to-day interactions with people and machines. As a highlight, Artilux launched two new products, including a multi-spectrum all-in-one bio-sensor for TWS earbuds and other wearables to enable digital health, and a dual-band 3D camera with optimal depth-sensing capability in NIR and SWIR spectra that is poised to enhance user experience in FinTech security, smart agriculture and food inspection, metaverse, and many more applications.
Artilux Announces New GeSi 3D Sensing Technology to Improve Eye Safety and Outdoor User Experiences
Artilux, an innovator in optical and electronics technology, announces its new Artilux Explore Series for wide spectrum 3D sensing. By operating at longer wavelength light than conventional solutions, the new Explore Series delivers exceptional accuracy, reduces the risk of eye damage and minimizes sunlight interference, enabling a consistent outdoor-indoor user experience. The breakthrough is based on a new GeSi technology platform developed by Artilux in cooperation with TSMC.
Unfolding New Dimensions of CMOS SWIR Imaging
Artilux, the pioneer of wide spectrum 3D sensing technology based on GeSi photonics, announced today the world’s first single-chip CMOS-based GeSi imager for a compact dual-mode (2D/3D) SWIR (Shortwave Infrared) sensing & imaging system. The high-resolution GeSi imager is fabricated at TSMC 12-inch CMOS production line, and is ready for commercialization at scale, enabling an ever-growing ecosystem to mark the beginning of SWIR sensing and imaging for consumer markets.