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Your search for "quantum photonics" returned 16 results.
Artilux Unveils World's First GeSi Wide Spectrum 3D Sensor at CES
At CES 2020, Artilux, an innovator in photonics and electronics technology, will be unveiling its Explore Series, the world's first wide spectrum 3D ToF (time-of-flight) sensor based on GeSi (germanium-on-silicon) photonic innovation. Operating at longer NIR (near infrared) wavelengths, the sensor can be used in the area of the spectrum that is more than 10 times safer than the currently-used 940nm wavelength, as well as improving sensing accuracy and performance under sunlight.
OmniVision and Artilux Announce Collaboration on NIR 3D Imaging and More
OmniVision, an industry leading developer of high performance CMOS image sensor solutions, and Artilux, the pioneer of wide spectrum 3D sensing technology based on GeSi photonics, jointly announced their execution of a formal letter of intent to collaborate in the field of CMOS image sensors and GeSi based 3D sensors, after a series of evaluation and analysis.
Artilux Announces Groundbreaking GeSi SPAD Research Published in Nature Journal
Artilux, the renowned leader of GeSi (germanium-silicon) photonics technology for CMOS (complementary metal-oxide-semiconductor) based SWIR (short-wavelength infrared) sensing and imaging, announced today that the research team at Artilux has made a breakthrough in advancing SWIR GeSi SPAD (single-photon avalanche diode) technology, which has been recognized and published by Nature, one of the world’s most prestigious scientific journals.
Artilux Unveils Artilux Connect HDMI 2.1 All Optical Solution
Artilux, an innovator in photonics and electronics technology, is unveiling its Connect Series, the world's first fully compliant all optical HDMI 2.1 IC solutions based on CMOS technology. The data transfer speed, handshakes and protocols are compliant from 1.4 all the way to 2.1. with HDP, DDC, HDCP, CEC, and ARC/eARC all enabled in the speed of light.
Unfolding New Dimensions of CMOS SWIR Imaging
Artilux, the pioneer of wide spectrum 3D sensing technology based on GeSi photonics, announced today the world’s first single-chip CMOS-based GeSi imager for a compact dual-mode (2D/3D) SWIR (Shortwave Infrared) sensing & imaging system. The high-resolution GeSi imager is fabricated at TSMC 12-inch CMOS production line, and is ready for commercialization at scale, enabling an ever-growing ecosystem to mark the beginning of SWIR sensing and imaging for consumer markets.
Artilux Launches Next-gen Sensing Technology with High Gain and Low Noise Performance for Automotive Applications
Artilux, the renowned leader in CMOS SWIR optical sensing technology and GeSi (Germanium Silicon) photonics technology today announced Germanium-Silicon Avalanche Photodiode (GeSi APD) array technology, the next-gen 3D imaging and sensing technology that achieves the unique high gain and low dark current with mature CMOS-based production. When being used with Optical Phased Array (OPA) technology, an optimal Solid-State LiDAR system will be implemented to improve sensing and to truly fulfill the affordable safety in autonomous driving.
II-VI Incorporated and Artilux Demonstrate a 3D Camera for Enhanced User Experience in the Metaverse
II‐VI Incorporated (Nasdaq: IIVI), a leader in semiconductor lasers, and Artilux, a leader in germanium silicon (GeSi) photonics and CMOS SWIR sensing technology, today announced a joint demonstration of a next-generation 3D camera with much longer range and higher image resolution to greatly enhances user experience in the metaverse.