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Artilux Launches Next-gen Sensing Technology with High Gain and Low Noise Performance for Automotive Applications
Artilux, the renowned leader in CMOS SWIR optical sensing technology and GeSi (Germanium Silicon) photonics technology today announced Germanium-Silicon Avalanche Photodiode (GeSi APD) array technology, the next-gen 3D imaging and sensing technology that achieves the unique high gain and low dark current with mature CMOS-based production. When being used with Optical Phased Array (OPA) technology, an optimal Solid-State LiDAR system will be implemented to improve sensing and to truly fulfill the affordable safety in autonomous driving.
Artilux and VisEra Presenting Next-gen Si-based Metalens Technology
Artilux, the leader of GeSi (germanium-silicon) photonics technology and pioneer of CMOS (complementary metal-oxide-semiconductor) based SWIR (short-wavelength infrared) optical sensing, imaging and communication, today announced its collaboration with VisEra Technologies (TWSE: 6789) on the latest Metalens technology. The newly unveiled Metalens technology differs from traditional curved lens designs by directly fabricating, on a 12” silicon substrate, fully-planar and high-precision nanostructures for precise control of light waves. By synergizing Artilux’s core GeSi technology with VisEra’s advanced processing capabilities, the demonstrated mass-production-ready Metalens technology significantly enhances optical system performance, production efficiency and yield. This cutting-edge technology is versatile and can be broadly applied in areas such as optical sensing, optical imaging, optical communication, and AI-driven commercial applications.
OmniVision and Artilux Announce Collaboration on NIR 3D Imaging and More
OmniVision, an industry leading developer of high performance CMOS image sensor solutions, and Artilux, the pioneer of wide spectrum 3D sensing technology based on GeSi photonics, jointly announced their execution of a formal letter of intent to collaborate in the field of CMOS image sensors and GeSi based 3D sensors, after a series of evaluation and analysis.
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