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Your search for "Photonic" returned 25 results.

2019/12/10

Artilux Unveils World's First GeSi Wide Spectrum 3D Sensor at CES

At CES 2020, Artilux, an innovator in photonics and electronics technology, will be unveiling its Explore Series, the world's first wide spectrum 3D ToF (time-of-flight) sensor based on GeSi (germanium-on-silicon) photonic innovation. Operating at longer NIR (near infrared) wavelengths, the sensor can be used in the area of the spectrum that is more than 10 times safer than the currently-used 940nm wavelength, as well as improving sensing accuracy and performance under sunlight.

2021/06/30

Unfolding New Dimensions of CMOS SWIR Imaging

Artilux, the pioneer of wide spectrum 3D sensing technology based on GeSi photonics, announced today the world’s first single-chip CMOS-based GeSi imager for a compact dual-mode (2D/3D) SWIR (Shortwave Infrared) sensing & imaging system. The high-resolution GeSi imager is fabricated at TSMC 12-inch CMOS production line, and is ready for commercialization at scale, enabling an ever-growing ecosystem to mark the beginning of SWIR sensing and imaging for consumer markets.

2020/07/08

Artilux Unveils Artilux Connect HDMI 2.1 All Optical Solution

Artilux, an innovator in photonics and electronics technology, is unveiling its Connect Series, the world's first fully compliant all optical HDMI 2.1 IC solutions based on CMOS technology. The data transfer speed, handshakes and protocols are compliant from 1.4 all the way to 2.1. with HDP, DDC, HDCP, CEC, and ARC/eARC all enabled in the speed of light.

2019/08/15

Artilux Announces New GeSi 3D Sensing Technology to Improve Eye Safety and Outdoor User Experiences

Artilux, an innovator in optical and electronics technology, announces its new Artilux Explore Series for wide spectrum 3D sensing. By operating at longer wavelength light than conventional solutions, the new Explore Series delivers exceptional accuracy, reduces the risk of eye damage and minimizes sunlight interference, enabling a consistent outdoor-indoor user experience. The breakthrough is based on a new GeSi technology platform developed by Artilux in cooperation with TSMC.

2023/09/21

USB4-Over-Fiber IC Solution, a New Era of Lighter, Longer, and Affordable Data Transfer Medium for Consumer Markets

Artilux, the renowned leader of GeSi (Germanium Silicon) photonic technology as well as CMOS-based SWIR sensing, imaging and optical communication technology, announced today the launch of the mass-production-ready USB4 active-optical-cable IC solution. Along with Artilux’s existing IC solutions for all-optical and hybrid optical/electrical HDMI™ and DisplayPort™ applications, today’s announcement on the USB4 active-optical-cable IC solution further positions Artilux’s Connect Series product line as the most comprehensive offering in high-speed optical communications solutions for mainstream consumer markets.

2024/02/22

Artilux Announces Groundbreaking GeSi SPAD Research Published in Nature Journal

Artilux, the renowned leader of GeSi (germanium-silicon) photonics technology for CMOS (complementary metal-oxide-semiconductor) based SWIR (short-wavelength infrared) sensing and imaging, announced today that the research team at Artilux has made a breakthrough in advancing SWIR GeSi SPAD (single-photon avalanche diode) technology, which has been recognized and published by Nature, one of the world’s most prestigious scientific journals.

2026/04/15

Artilux Announces Inception™: A Hybrid Optoelectronic Architecture for the Next-Generation AI Computing

Artilux today announced Inception™, an AI computing paradigm shift from conventional digital electronics to novel hybrid optoelectronics, delivering orders-of-magnitude improvements in both power and area efficiencies without relying on advanced CMOS process nodes and active cooling.

2026/11/01

Senior Digital Circuit Design Engineer

Artilux is dedicated to pushing the boundaries of innovation by combining advanced photonics with digital IC design to deliver groundbreaking solutions. As part of our core development team, you will have the opportunity to work on cutting-edge projects from the ground up and contribute directly to technologies that will shape the future. If you are passionate about taking on new challenges and eager to grow your expertise in a rapidly evolving field, we warmly welcome you to join our journey!

2026 Taiwan-Europe Chip Innovation Forum (TECIF)

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