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Senior Digital Circuit Design Engineer
Artilux is dedicated to pushing the boundaries of innovation by combining advanced photonics with digital IC design to deliver groundbreaking solutions. As part of our core development team, you will have the opportunity to work on cutting-edge projects from the ground up and contribute directly to technologies that will shape the future. If you are passionate about taking on new challenges and eager to grow your expertise in a rapidly evolving field, we warmly welcome you to join our journey!
OmniVision and Artilux Announce Collaboration on NIR 3D Imaging and More
OmniVision, an industry leading developer of high performance CMOS image sensor solutions, and Artilux, the pioneer of wide spectrum 3D sensing technology based on GeSi photonics, jointly announced their execution of a formal letter of intent to collaborate in the field of CMOS image sensors and GeSi based 3D sensors, after a series of evaluation and analysis.
Artilux Launches Next-gen Sensing Technology with High Gain and Low Noise Performance for Automotive Applications
Artilux, the renowned leader in CMOS SWIR optical sensing technology and GeSi (Germanium Silicon) photonics technology today announced Germanium-Silicon Avalanche Photodiode (GeSi APD) array technology, the next-gen 3D imaging and sensing technology that achieves the unique high gain and low dark current with mature CMOS-based production. When being used with Optical Phased Array (OPA) technology, an optimal Solid-State LiDAR system will be implemented to improve sensing and to truly fulfill the affordable safety in autonomous driving.
Artilux Unveils Artilux Connect HDMI 2.1 All Optical Solution
Artilux, an innovator in photonics and electronics technology, is unveiling its Connect Series, the world's first fully compliant all optical HDMI 2.1 IC solutions based on CMOS technology. The data transfer speed, handshakes and protocols are compliant from 1.4 all the way to 2.1. with HDP, DDC, HDCP, CEC, and ARC/eARC all enabled in the speed of light.
II-VI Incorporated and Artilux Demonstrate a 3D Camera for Enhanced User Experience in the Metaverse
II‐VI Incorporated (Nasdaq: IIVI), a leader in semiconductor lasers, and Artilux, a leader in germanium silicon (GeSi) photonics and CMOS SWIR sensing technology, today announced a joint demonstration of a next-generation 3D camera with much longer range and higher image resolution to greatly enhances user experience in the metaverse.
Unfolding New Dimensions of CMOS SWIR Imaging
Artilux, the pioneer of wide spectrum 3D sensing technology based on GeSi photonics, announced today the world’s first single-chip CMOS-based GeSi imager for a compact dual-mode (2D/3D) SWIR (Shortwave Infrared) sensing & imaging system. The high-resolution GeSi imager is fabricated at TSMC 12-inch CMOS production line, and is ready for commercialization at scale, enabling an ever-growing ecosystem to mark the beginning of SWIR sensing and imaging for consumer markets.
Artilux and VisEra Presenting Next-gen Si-based Metalens Technology
Artilux, the leader of GeSi (germanium-silicon) photonics technology and pioneer of CMOS (complementary metal-oxide-semiconductor) based SWIR (short-wavelength infrared) optical sensing, imaging and communication, today announced its collaboration with VisEra Technologies (TWSE: 6789) on the latest Metalens technology. The newly unveiled Metalens technology differs from traditional curved lens designs by directly fabricating, on a 12” silicon substrate, fully-planar and high-precision nanostructures for precise control of light waves. By synergizing Artilux’s core GeSi technology with VisEra’s advanced processing capabilities, the demonstrated mass-production-ready Metalens technology significantly enhances optical system performance, production efficiency and yield. This cutting-edge technology is versatile and can be broadly applied in areas such as optical sensing, optical imaging, optical communication, and AI-driven commercial applications.
Artilux Unveils World's First GeSi Wide Spectrum 3D Sensor at CES
At CES 2020, Artilux, an innovator in photonics and electronics technology, will be unveiling its Explore Series, the world's first wide spectrum 3D ToF (time-of-flight) sensor based on GeSi (germanium-on-silicon) photonic innovation. Operating at longer NIR (near infrared) wavelengths, the sensor can be used in the area of the spectrum that is more than 10 times safer than the currently-used 940nm wavelength, as well as improving sensing accuracy and performance under sunlight.
Artilux Announces Inception™: A Hybrid Optoelectronic Architecture for the Next-Generation AI Computing
Artilux today announced Inception™, an AI computing paradigm shift from conventional digital electronics to novel hybrid optoelectronics, delivering orders-of-magnitude improvements in both power and area efficiencies without relying on advanced CMOS process nodes and active cooling.